Fuji Electric Sdn Bhd | High-Capacity Split Casing Pump Supply

Semiconductor fabrication plants operate under extreme thermal loads 24/7 due to heavy manufacturing equipment and stringent cleanroom climate control parameters. Any sudden fluctuation in temperature or a drop in utility fluid velocity can compromise delicate silicon wafer processing, leading to expensive batch failures and production downtime. The facility required a robust mechanical infrastructure capable of moving massive volumes of water continuously while minimizing energy consumption and allowing for swift, non-disruptive routine maintenance.

To secure maximum thermal management efficiency and system reliability, heavy-duty Ebara Horizontal Split Casing Pumps were integrated into the factory's central cooling infrastructure:

• Condenser Water Pump (CDWP) Loop: Driven by the heavy-duty 300 x 250 CNGC 90 model. Paired with a 90kW IE3 motor spinning a 340mm impeller, this unit achieves 82.8% efficiency to deliver a massive capacity of 11,670 L/min at 30m head to swiftly dissipate core facility heat.
• Chilled Water Pump (CHWP) Loop: Managed by the high-volume 300 x 250 CNEC 37 model. Powered by a 37kW IE3 motor with a 274mm impeller, it runs at 81.0% efficiency to maintain an uninterrupted cold fluid supply line at 10,080 L/min at 15m head.

The horizontal split casing architecture of both models provides a major maintenance advantage: the top half of the casing can be removed to service rotating elements without disconnecting any underlying piping networks, drastically reducing potential factory downtime.